Page 18 - 《橡塑技术与装备》英文版2025年12月

HINA R&P TECHNOLOGY AND EQUIPMENT

Research on processing technology and

properties oflow-viscosity adhesive sheets

Zhang Dianchao, Feng Chunming, Yang Tianyu, Jin Xia*

(The 46th Research Institute of China Electronics Technology Group Corporation, Tianjin 300220, China)

Abstract: As a crucial basic material in the manufacturing of multilayer printed circuit boards (PCB),
prepreg, despite its relatively thin thickness, demands high standards for surface flatness, mechanical
properties, and surface tackiness. Research indicates that tension can affect the average thickness, while
tension, vehicle speed, and adhesive viscosity all influence the tackiness of the material. Through DOE
experiments to optimize process parameters, the material exhibits excellent surface flatness (with a thickness
standard deviation of 0.0071) and an extremely low tacky area ratio (10%) when subjected to a tension of 25 N,
a vehicle speed of 13 m/min, and an adhesive viscosity of 410 cps. SEM examination reveals no microcracks in
the material, with its tensile strength reaching 10.68 MPa, an increase of over 35%, and its elongation at break
reaching 74.1%, an increase of over 33%.
Key words: adhesive sheet; glue viscosity; tensile strength; elongation at break
Classification number: TQ330.387 Article number: 1009-797X (2025) 12-0016-06
Document code: B DOI: 10.13520/j.cnki.rpte.2025.12.004

0 Introduction usually required to be extremely thin (generally less than 120
With the development of electronic devices towards high μm), but the surface flatness is highly required. The use of two
performance and miniaturization, the demand for multi-layer or more layers of multi-layer bonding sheets is also common.
printed circuit boards (PCBs) is growing. As a key material However, misalignment, bubbles, and overlapping wrinkles
for interlayer bonding in PCBs, the performance of prepreg between bonding sheets during stacking can seriously affect the
directly affects the reliability of PCBs. Traditional prepreg processing quality of PCBs. Therefore, in the research work
materials are usually composed of resin-impregnated glass on bonding sheets, the evaluation of the mechanical properties
fiber cloth, which needs to be fully cured during the subsequent (tensile strength and elongation at break) and tackiness of
lamination process to achieve interlayer bonding. The dielectric the material is also crucial. The use of impregnation process
loss of this material is limited by raw materials and processing to produce bonding sheets is prone to adhesion failure due
techniques, making it difficult to achieve a value lower than to high tackiness during cutting, inspection, packaging, and
0.0015. PTFE materials have attracted increasing attention due transportation. Moreover, during the multi-layer lamination
to their extremely low loss (theoretical loss value of 0.0009). process by users, problems such as delamination and
However, PTFE has self-lubricating properties and lacks board bursting due to low mechanical properties are easily
viscosity, making it difficult to achieve bonding performance encountered, affecting the final product quality.
directly using this material. This study systematically analyzes the impact of key
Wang and his team used sintered fusible parameters in the impregnation process on the microstructure,
polytetrafluoroethylene as the matrix resin to prepare
Biography: Zhang Dianchao (1982-), master's degree, senior engineer,
fluororesin flexible copper clad laminates. In practical
primarily engaged in research on the application of composite materials in
applications, the thickness of the bonding sheet material is the electronics industry.

12
51
·12·
·12· Vol.51，No.12
期
第
卷 第